Topology Optimization and Cooling Structures for Electronic Equipment in Small Satellites

Data processing capacity and power demands are rapidly increasing in telecom and scientific payloads. That, together with miniaturization of systems, leads often to performance limitation due to insufficient cooling, which therefore limits the revenue that can be obtained from the equipment. Optimized design of satellite structures and cooling systems combined is therefore key to enable the next generation of very high through-put small satellites and to push the boundaries of the future space industry.

This paper focuses on the application of topology optimization at the design of an electronics frame for a high power satellite application. The main objective is to obtain a minimum mass design ensuring that it withstands the demanding mechanical and thermal loads. The design incorporates embedded heat pipes to improve thermal management and ensure efficient heat dissipation thanks to fluid phase change. Furthermore, this project aims to demonstrate the use of additive manufacturing as the optimal manufacturing method for optimized designs, allowing for agile and flexible processes which can be tailored to almost any use case. The paper addresses the challenge of reducing the mass of satellite components while maintaining structural integrity and thermal performance. The Solid Isotropic Material with Penalization (SIMP) method was used for the topology optimization, using tools such as Hypermesh and Optistruct.

The outcome is an electronics frame with embedded heat pipes, designed to support a PCB within a satellite. The structure can withstand the mechanical loads experienced during launch and can dissipate the heat generated by the PCB and its electronic components. The optimization process allows to obtain a 15% lighter design in comparison with a traditional electronic frame. Furthermore, the maximum temperature is decreases by 15-30degrees, which can be directly translated in an increased power throughput and therefore equipment value of 20-50%.